Pontificia Universidad Católica de Chile Pontificia Universidad Católica de Chile
E Ramos-Moore, A Rosenkranz, L F Matamala, A Videla, A Durán and J Ramos-Grez 2017 IOP Conf. Ser.: Mater. Sci. Eng. 258 012009 (2017)

Effect of surface etching and electrodeposition of copper on nitinol

Revista : IOP Conference Series: Materials Science and Engineering
Volumen : 258
Páginas : 9
Tipo de publicación : Conferencia No DCC Ir a publicación


Nitinol-based materials are very promising for medical and dental applications since those materials can combine shape memory, corrosion resistance, biocompatibility and antibacterial properties. In particular, surface modifications and coating deposition can be used to tailor and to unify those properties. We report preliminary results on the study of the effect of surface etching and electrodeposition of Copper on Nitinol using optical, chemical and thermal techniques. The results show that surface etching enhances the surface roughness of Nitinol, induces the formation of Copper-based compounds at the Nitinol-Copper interface, reduces the austenitic-martensitic transformations enthalpies and reduces the Copper coating roughness. Further studies are needed in order to highlight the influence of the electrodeposited Copper on the memory shape properties of NiTi.